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A-SAP™ Frequently Asked Questions
Introduction to A-SAP™, the Averatek Semi-Additive Process
Here are answers to the most frequently-asked questions….illustrated. Click through these 11 slides for a brief overview of the A-SAP™ process. Contact our leadership team with your questions at averatekcontact@gmail.com.
How reliable is A-SAP™ technology? The process is a proven and tested additive fabrication method to achieve next-generation advancements. Multiple coupon configurations and process runs have been tested at multiple facilities with passing results. Testing is ongoing, with more than 1000 panels processed to date.
What is A-SAP™?
This revolutionary technology is a semi-additive PCB fabrication process. Rather than starting with copper clad laminate, this starts with bare dielectric and the application of ultra thin electroless copper. The conductive traces are then formed with electrolytic copper, to whatever thickness that is needed, resulting in precise trace patterns with straight sidewalls.
How is A-SAP™ different from traditional processes?
A-SAP™ changes the way we work with electroless plating. Using Liquid Metal Ink ™, ultra-dense layers of electroless copper are used to provide a thin, uniform colloidal coating at the atomic level. See the process at https://bit.ly/3pJ0L1O
How does A-SAP™ work?
It is not a subtractive-etch process: A-SAP™ adds thick copper traces to the very thin copper base layer, creating well defined features that have straight, not tapered side walls. The very thin copper base layer is easily removed with light etching, leaving a precise copper circuit behind.
What materials are compatible?
A-SAP™ is compatible with nearly all laminates/ photoresists. Averatek is working closely with all major laminate suppliers, notably: Rogers, Panasonic, Isola, DuPoint, MacDermid, EMC, et al. Contact us for an up-to-date list of compatible materials at tara@averatek.com
Which electronic design tools should be used to work with A-SAP™?
A-SAP™ is compatible with every electronic design tool: all major software vendors have this new technology under consideration. The most important Design rule when working with a brand-new technology: be sure to collaborate closely with your fabricator – communication is key.
Which manufacturers are building with A-SAP™ today?
With a description of your project, the Averatek leadership team can refer you to the right fabricator for the job. Talk with us at tara@averatek.com
What about copper adhesion to the dielectric with A-SAP™?
Adhesion is equivalent to – or better – than with traditional processes. Testing is aligned with IPC requirements. Contact us for peel strength data at tara@averatek.com
How much improvement can be achieved with A-SAP™ in RF impedance variation?
A-SAP™ impedance has been shown to be less than 5%, compared to the typical industry tolerances of 10%.